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Our equipment can handle surface mount devices with the following sizes:
0201, 0402, 0603, 0805, 1206...., SOT23, SOT89, SOT122, SO8, SO16, PLCC4 - 84, QFP 0,5 mm, BGA
Printed circuit boards designed for SMDs should be delivered in panels, preferably with maximum dimensions of 420 x 250 mm. If the some elements are closer than 3 mm to the edge of the PCB , then the panel should have a clearance border.
We are able to assemble PROTOTYPES also delivered as single PCBs.
| Minimum PCB dimensions: |
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40 x 50 mm |
| Maximum PCB dimensions: |
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420 x 300 mm |
| SMT populating capacity: |
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15 000 pcs/h |
Our equipment:
Pick & Place Machine
Assembleon Opal XII
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Pick & Place Machine
TESCON 307
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UNIPRINT - device for manual glue or solder paste application
UNIPRINT G02-V - semi-automatic device for glue or solder paste application
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| HELLER 1707EXL - automatic reflow soldering oven 7 Heat zones / 1 Cool |
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ASSCON VP 3000 - 28 - Vapor-Phase Soldering System.
The innovative inline soldering system operates according to oxygen free process. Components such as QFPs, BGAs, Flip-Chip and hybrids are processed with high quality results. |
| Mantis - optical system for visual control |
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ERSA Digital 2000 - multi-purpose repair station |
Technological materials used for populating with SMDs:
Solder pastes:
- Heraeus (lead-containing)
- KOKI Company Ltd. (lead-free)
- Qualitec
Glues:
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